Gate formation with varying work function layers

ABSTRACT

A structure and a method of forming are provided. A first work function layer is formed over a first fin and terminates closer to the first fin than an adjacent second fin. A second work function layer is formed over the first work function layer and terminates closer to the second fin than the adjacent second fin. A third work function layer is formed over the first work function layer and the second fin. A conductive layer is formed over the third work function layer.

BACKGROUND

Metal-Oxide-Semiconductor (MOS) devices are basic building elements inintegrated circuits. An existing MOS device typically has a gateelectrode formed of polysilicon doped with p-type or n-type impurities,using doping operations such as ion implantation or thermal diffusion.The work function of the gate electrode may be adjusted to the band-edgeof silicon. For an n-type Metal-Oxide-Semiconductor (NMOS) device, thework function may be adjusted to close to the conduction band ofsilicon. For a P-type Metal-Oxide-Semiconductor (PMOS) device, the workfunction may be adjusted to close to the valence band of silicon.Adjusting the work function of the polysilicon gate electrode can beachieved by selecting appropriate impurities.

MOS devices with polysilicon gate electrodes exhibit carrier depletioneffect, which is also known as a poly depletion effect. The polydepletion effect occurs when the applied electrical fields sweep awaycarriers from gate regions close to gate dielectrics, forming depletionlayers. In an n-doped polysilicon layer, the depletion layer includesionized non-mobile donor sites, wherein in a p-doped polysilicon layer,the depletion layer includes ionized non-mobile acceptor sites. Thedepletion effect results in an increase in the effective gate dielectricthickness, making it more difficult for an inversion layer to be createdat the surface of the semiconductor.

The poly depletion problem may be solved by forming metal gateelectrodes, wherein the metallic gates used in NMOS devices and PMOSdevices may also have band-edge work functions. Accordingly, theresulting metal gates include a plurality of layers to suit therequirements of the NMOS devices and PMOS devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 20B illustrate various intermediate stages in theformation of a Fin Field-Effect Transistor (FinFET) in accordance withsome embodiments.

FIG. 21 illustrates a flow chart of a process for forming a FinFET inaccordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underlying,” “below,”“lower,” “overlying,” “upper” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

Transistor and the methods of forming the same are provided inaccordance with various exemplary embodiments. The intermediate stagesof forming the transistors are illustrated in accordance with someembodiments. Some variations of some embodiments are discussed.Throughout the various views and illustrative embodiments, likereference numbers are used to designate like elements. In theillustrated exemplary embodiments, the formation of Fin Field-EffectTransistors (FinFETs) is used as an example to explain the embodimentsof the present disclosure. Planar transistors may also adopt the conceptof the present disclosure.

FIGS. 1 through 20B illustrate various intermediate stages infabricating FinFETs in accordance with some embodiments of the presentdisclosure. The process described herein relates to forming multipletransistors having different operating characteristics that may share acommon gate. For example, in an embodiment a p-type transistor and ann-type transistor may share a common gate in, for example, an inverter.In situations such as these, it may be desirable to adjust the gateelectrode such that the work function of the gate electrode is tuned forthe particular operating characteristics. Throughout the description,when a metal layer is referred to as a work-function metal, it indicatesit has a work function that fits the type of the respective FinFET, andits location in the metal gate allows its work function to affect ordetermine the work function of the respective FinFET. For example, whenthe FinFET is an n-type FinFET, the work-function metal preferably has alow work function, which is lower than the mid-gap work function (about4.5 eV). The work function of the respective work-function metal may bereferred to as an n-work function, which is lower than about 4.3 eV, andmay be in the range between about 3.9 eV and about 4.3 eV. When theFinFET is a p-type FinFET, the work-function metal has a high workfunction, which is higher than the mid-gap work function. The workfunction of the respective work-function metal may be referred to as ap-work function, which is higher than about 4.5 eV, and may be in therange between about 4.7 eV and about 5.1 eV.

In the description that follows, examples are provided assuming a firstfin 210 _(A) (see, e.g., FIG. 20B) is formed having three work functionlayers and a second fin 210 _(B) (see, e.g., FIG. 20B) is formed havingone work function layer. In this example, the first fin 210 _(A) isassumed to be a p-type FinFET and the second fin 210 _(B) is assumed tobe a n-type FinFET. Three work function layers will be formed over thefirst fin 210 _(A) for the p-type FinFET and one work function layerwill be formed over the second fin 210 _(B) for the n-type FinFET. Thethree work function layers may be, for example, two layers of p-typework function metals (such as TiN or other p-type work function metals)and one layer of an n-type work function metal (such as TiAl or othern-type work function metals), whereas the one layer of the n-type workfunction metal will be used over the second fin 210 _(B) of the n-typeFinFET.

As another example, the first fin 210 _(A) may be part of an n-typeFinFET and the second fin 210 _(B) may be part of a p-type FinFET. Inthis example, the three work function layers over the first fin 210 _(A)may be, for example, two layers of n-type work function metals (such asTiAl or other n-type work function metals) and one layer of a p-typework function metal (such as TiN or other p-type work function metals),whereas the one layer of the p-type work function metal will be usedover the second fin 210 _(B) of the p-type FinFET. Other materials,processes, and configurations may be utilized within the scope of thepresent disclosure.

The steps shown in FIGS. 1 through 20B are also reflected schematicallyin the process flow shown in FIG. 21.

FIG. 1 illustrates a perspective view of an initial structure. Theinitial structure includes a substrate 102 having semiconductor strips106 extending therefrom. The respective step is illustrated as step 202in the process flow shown in FIG. 21. The substrate 102 is formed of asemiconductor material having a first lattice constant. As will beexplained in greater detail below, another semiconductor layer having asecond lattice constant, different than the first lattice constant, willbe formed over material of the substrate 102. In some embodiments, thesubstrate 102 comprises a crystalline silicon substrate (e.g., wafer),although other suitable elemental semiconductor, such as a suitablecompound semiconductor (e.g., gallium arsenide, silicon carbide, indiumarsenide, indium phosphide, or the like), or a suitable alloysemiconductor (e.g., silicon germanium carbide, gallium arsenicphosphide, or gallium indium phosphide), or the like, may also be used.Further, the substrate 102 may include an epitaxial layer (epi-layer),may be strained for performance enhancement, and/or may include asilicon-on-insulator (SOI) structure.

Furthermore, the substrate 102 may include other features. For example,the substrate may include various doped regions depending on designrequirements (e.g., p-type substrate or n-type substrate). For example,the doped regions may be doped with p-type dopants, such as boron orBF₂, n-type dopants, such as phosphorus or arsenic, and/or combinationsthereof. The doped regions may be configured for an n-type FinFET and/ora p-type FinFET.

The substrate 102 may be patterned using, for example, photolithographytechniques. For example, a mask layer (not shown), such as a pad oxidelayer and an overlying pad nitride layer, is formed over the substrate102. The pad oxides layer may be a thin film comprising silicon oxideformed, for example, using a thermal oxidation process. The pad oxidelayer may act as an adhesion layer between the substrate 102 and theoverlying pad nitride layer and may act as an etch stop layer foretching the pad nitride layer. In an embodiment, the pad nitride layeris formed of silicon nitride, for example, using low-pressure chemicalvapor deposition (LPCVD) or plasma enhanced chemical vapor deposition(PECVD).

The mask layer may be patterned using photolithography techniques.Generally, photolithography techniques utilize a photoresist material(not shown) that is deposited, irradiated (exposed), and developed toremove a portion of the photoresist material. The remaining photoresistmaterial protects the underlying material, such as the mask layer inthis example, from subsequent processing steps, such as etching. In thisexample, the photoresist material is patterned to define the pad oxideand pad nitride.

The patterned mask is subsequently used to pattern exposed portions ofthe substrate 102 to form trenches 104, thereby defining semiconductorstrips 106 between adjacent trenches 104 as illustrated in FIG. 1. Aswill be discussed below, the trenches 104 will be subsequently filledwith a dielectric material, forming isolation regions such as shallowtrench isolation (STI) regions adjacent to the semiconductor strips 106.In some embodiments, the trenches 104 may be strips (viewed from in thetop) parallel to each other, and closely spaced with respect to eachother. In some embodiments, the trenches 104 may be continuous andsurrounding the semiconductor strips 106.

Isolation regions, such as STI regions 108, may be formed to extend froma top surface of substrate 102 into substrate 102, wherein the topsurface of substrate 102 is a major surface 102A of the substrate orwafer. The portions of substrate 102 between neighboring STI regions 108are referred to as semiconductor strips 106. The top surfaces ofsemiconductor strips 106 and the top surfaces of STI regions 108 may besubstantially level (within process variations) with each other inaccordance with some exemplary embodiments.

STI regions 108 may include a liner oxide (not shown). The liner oxidemay be formed of a thermal oxide formed through a thermal oxidation of asurface layer of substrate 102. The liner oxide may also be a depositedsilicon oxide layer formed using, for example, Atomic Layer Deposition(ALD), High-Density Plasma Chemical Vapor Deposition (HDPCVD), orChemical Vapor Deposition (CVD). STI regions 108 may also include adielectric material over the liner oxide, wherein the dielectricmaterial may be formed of Flowable Chemical Vapor Deposition (FCVD),spin-on, or the like.

In some embodiments, the STI regions 108 may be a silicon oxide layerformed using an HDPCVD process, using silane (SiH₄) and oxygen (O₂) asreacting precursors. In other embodiment, the STI regions 108 may beformed using a sub-atmospheric CVD (SACVD) process or high aspect-ratioprocess (HARP), wherein process gases may comprisetetraethylorthosilicate (TEOS) and ozone (O₃). In yet other embodiments,the STI regions 108 may be formed using a spin-on-dielectric (SOD)process, such as hydrogen silsesquioxane (HSQ) or methyl silsesquioxane(MSQ). Other processes and materials may be used. A planarizationprocess, such as a chemical mechanical polish (CMP) process, may beperformed to remove excess materials to form the STI regions 108 asillustrated in FIG. 1.

Referring to FIG. 2, STI regions 108 are recessed, so that top portionsof semiconductor strips 106 protrude higher than the top surfaces of STIregions 108 to form protruding fins 210. The respective step isillustrated as step 204 in the process flow shown in FIG. 21. Theetching may be performed using one or more etching processes. Forexample, a dry etching process using NF₃ and NH₃ as the etching gasesmay be used in embodiments in which the STI regions 108 are formed ofsilicon oxide. Argon may also be included. In accordance withalternative embodiments of the present disclosure, the recessing of STIregions 108 may be performed using a wet etch process, such as a dilutedHF wet etch.

Referring to FIG. 3, dummy gate stack 310 is formed on the top surfacesand the sidewalls of protruding fins 210. The respective step isillustrated as step 206 in the process flow shown in FIG. 21. Dummy gatestack 310 may include dummy gate dielectric 312 and dummy gate electrode314 over dummy gate dielectric 312. Dummy gate electrode 314 may beformed, for example, using polysilicon, but other materials may also beused. Dummy gate stack 310 may also include one or more hard masks, suchas hard mask 316, over dummy gate electrode 314. Hard mask layer 316 maybe formed of silicon nitride, silicon carbo-nitride, or the like. Dummygate stack 310 may also have a lengthwise direction substantiallyperpendicular (e.g., within process variations) to the lengthwise orlongitudinal direction of protruding fins 210.

Next, gate spacers 318 are formed on the sidewalls of dummy gate stack310. In accordance with some embodiments of the present disclosure, gatespacers 318 are formed of a dielectric material such as silicon nitride,silicon oxy-carbo-nitride (SiOCN), silicon carbon-nitride (SiCN), or ametal oxide such as aluminum oxide. In accordance with some embodimentsof the present disclosure, spacer layer is formed of SiOCN, and may havea single-layer structure. In accordance with alternative embodiments,spacer layer has a composite structure including a plurality of layers.For example, spacer layer may include a silicon oxide layer, and asilicon nitride layer over the silicon oxide layer.

The gate spacers 318 may be formed by anisotropically etching ablanket-deposited layer. In accordance with some embodiments of thepresent disclosure, a spacer layer (not shown) is formed using aconformal deposition method such as ALD, CVD, etc., so that the sidewallportions of spacer layer have an adequate thickness. The horizontalportions and vertical portions of spacer layer may have substantiallythe same thickness, for example, with the vertical thickness of thevertical portions and the horizontal thickness of the horizontalportions having a difference smaller than 20 percent of the horizontalthickness.

An anisotropic etching is performed to remove the horizontal portions ofspacer layer. The remaining vertical portions of spacer layer form gatespacers 318 on the sidewalls of dummy gate stack 310. Though not shown,portions of the spacer layer may remain adjacent to the protruding fins210.

As illustrated in FIG. 4, an etching step (referred to as source/drainrecessing hereinafter) is then performed to etch portions of protrudingfins 210 that are not covered by dummy gate stack 310 and dummy gatespacers 318 in accordance with some embodiments. The respective step isillustrated as step 208 in the process flow shown in FIG. 21. Therecessing may be anisotropic, and hence the portions of fins 210directly underlying dummy gate stack 310 and dummy gate spacers 318 areprotected and are not etched. The top surfaces of the recessedsemiconductor strips 106 may be lower than the top surfaces of STIregions 108 in accordance with some embodiments. Recesses 410 areaccordingly formed between STI regions 108. Recesses 410 are located onopposite sides of dummy gate stack 310.

Next, as illustrated in FIG. 5, source/drain regions 510 are formed. Thesource/drain regions may be formed using an epitaxial process toselectively grow a semiconductor material in recesses 410 (see FIG. 4).The respective step is illustrated as step 210 in the process flow shownin FIG. 21. In accordance with some exemplary embodiments, source/drainregions 510 include silicon germanium or silicon. Depending on whetherthe resulting FinFET is a p-type FinFET or an n-type FinFET, the epitaxyregions may be in situ doped with a p-type or an n-type impurity. Forexample, when the resulting FinFET is a p-type FinFET, silicon germaniumboron (SiGeB) may be grown. Conversely, when the resulting FinFET is ann-type FinFET, silicon phosphorous (SiP) or silicon carbon phosphorous(SiCP) may be grown. In accordance with alternative embodiments of thepresent disclosure, epitaxy regions comprise III-V compoundsemiconductors such as GaAs, InP, GaN, InGaAs, InAlAs, GaSb, AlSb, AlAs,AlP, GaP, combinations thereof, or multi-layers thereof. After recesses410 are filled with epitaxy regions, the further epitaxial growth ofepitaxy regions causes epitaxy regions to expand horizontally, andfacets may be formed.

After the epitaxy step, epitaxy regions may be further implanted with ap-type or an n-type impurity to form source/drain regions 510. Inaccordance with alternative embodiments of the present disclosure, theepitaxy regions are in-situ doped with the p-type or n-type impurityduring the epitaxy process, and the implantation step is skipped.Epitaxy regions include lower portions that are formed in STI regions108, and upper portions that are formed over the top surfaces of STIregions 108. Lower portions, whose sidewalls are shaped by the shapes ofrecesses 410 (FIG. 4), may have (substantially) straight edges, whichmay also be substantial vertical edges that are substantiallyperpendicular to the major surfaces of substrate 102.

FIG. 6 illustrates a perspective view of the structure after silicideregions 608 and an Inter-Layer Dielectric (ILD) 610 are formed. Therespective step is illustrated as step 212 in the process flow shown inFIG. 21. Source/drain silicide regions 608 are formed on the surfaces ofsource/drain regions 510. The formation process includes depositing ametal layer on the source/drain regions 510, and performing an anneal toreact the metal layer with the exposed surface portions of epitaxyregions, so that silicide regions 608 are formed.

The ILD 610 may comprise a single layer or multiple layers. For example,in some embodiments an ILD liner (not shown) is deposited, and an ILDfiller material is deposited over the ILD liner. In some embodiments,the ILD liner comprises SiO₂, SiCN, SiON, Si₃N₄, and SiN_(x)H_(y), butother suitable dielectric materials may be used. The ILD liner mayfurther comprise a plurality of layers that comprise combinations of theabove mentioned materials. The ILD liner may be deposited through one ormore processes such as PVD, CVD, or ALD, although any acceptable processmay be utilized. Other materials and/or processes may be used.

In some embodiments, the ILD filler material comprises SiO₂, SiCN, SiOC,SiON, Si₃N₄, and SiN_(x)H_(y), but other suitable dielectric film may beused. The isolation dielectric may be cured or treated after deposition.For example, the curing may involve irradiation with ultra-violetradiation, and the treatment may involve annealing in N₂, O₂, or H₂Oambient at temperatures ranging above 200° C. After the curing ortreatment, the isolation dielectric may have a relative permittivity ofless than 6, such as less than 5, and such as less than 4. For example,the isolation dielectric may be SiO₂ formed by CVD, PECVD or ALDdeposition process, FCVD, or a spin-on-glass process. A planarizationprocess, such as a CMP process, may be performed to remove excessmaterials and to expose dummy gate stack 310.

As illustrated in FIG. 7, portions of the ILD 610 are removed to formsource/drain contacts 710. The respective step is illustrated as step214 in the process flow shown in FIG. 21. The ILD 610 may be patternedto form openings to expose the source/drain regions 510/silicide regions608 using photolithography processes in combination with one or moreetching processes. In embodiments in which the ILD 610 is formed ofsilicon oxide, the etch process may be, for example, a dry etch, achemical etch, or a wet cleaning process. For example, the chemical etchmay employ fluorine-containing chemical such as dilute hydrofluoric(dHF) acid. Other materials and/or processes may be used.

Thereafter, the openings may be filled with one or more conductivelayers to form the source/drain contacts 710. The source/drain contacts710 may comprise a single layer or a multi-layer structure. For example,in some embodiments the source/drain contacts 710 comprise a liner, suchas a diffusion barrier layer, an adhesion layer, or the like, and acontact filler formed over the contact liner in the openings. Thecontact liner may include Ti, TiN, Ta, TaN, or the like formed by ALD,CVD, or the like. The contact filler may be formed by depositing aconductive material, such as one or more layers of Ni, Ta, TaN, W, Co,Ti, TiN, Al, Cu, Au, alloys thereof, combinations thereof, or the like,but other suitable metal may be used. A planarization process, such as aCMP, may be performed to remove excess material from a surface of theILD 610, thereby forming the contacts as illustrated in FIG. 7.

The above process generally describes a FinFET structure and a method offorming for illustration purposes. Other structures and processes may beused. For example, multiple epitaxial regions and differentfin/epitaxial shapes may be used. Additionally, while the structure andthe figures described above illustrate a single fin for each of thesource/drain regions, multiple fins may share a common source/drainregion, in which the epitaxial regions are separated or grown together.The epitaxial regions grown together may have faceted upper surfaces orrelatively flat upper surfaces, and may include voids between theepitaxial regions and the ILD. As another example, different oradditional spacer structures, masks, liners, and the like may be used.

As will be described in greater detail below with reference to FIGS.8A-20B, the dummy gate stack 310 will be replaced with a metal gatestructure, whereas the “A” labeled figures are plan views of the areaaround the dummy gate stack 310 as illustrated in FIG. 7, and the “B”labeled figures are taken along the B-B′ cross section illustrated inFIG. 7. Moreover, one or more work function layers will be formed overeach of the fins 210, such that the work function layers are adjustedfor the particular desired electrical characteristics of eachtransistor. For example, in some situations in a PMOS transistor and anNMOS transistor may have a shared gate, such as for an inverter, but thework function layers of the NMOS transistor may be tuned independentlyof the PMOS transistor to increase performance of each transistor. Assuch, the following discussion describes a device and a method ofmanufacturing a device in which two transistors share a common gate, buthave different work function layers.

Referring first to FIGS. 8A and 8B, there is shown for reference theplan view and cross-sectional view, respectively, of the structureillustrated in FIG. 7 for reference prior to proceeding further withprocessing.

Thereafter, as illustrated in FIGS. 9A and 9B, the dummy gate stack 310(see FIGS. 8A and 8B), including hard mask layer 316, dummy gateelectrode 314, and dummy gate dielectric 312, are removed, therebyforming a recess 910. The respective step is illustrated as step 216 inthe process flow shown in FIG. 21. The removal process may comprise oneor more etch processes. For example in embodiments in which the ILD 610comprises silicon oxide, the hard mask 316 comprises silicon nitride,the dummy gate electrode 314 comprises polysilicon, and the dummy gatedielectric 312 comprises silicon oxide, the removal process may compriseselectively etching using either dry or wet etching. In this example,the hard mask layer 316 may be removed by using a dry etch with aprocess gas including CF₄, CHF₃, CH₂F₂, CH₃F, NF₃, SF₆, or combinationsthereof, and the dummy gate electrode 314 may be removed using a dryetch with a process gas including CF₄, CHF₃, NF₃, SF₆, Br₂, HBr, Cl₂, orcombinations thereof. Diluting gases such as N₂, O₂, or Ar mayoptionally be used. In the case wet etching is used to remove the dummygate electrode 314, the chemicals may include NH₄OH:H₂O₂:H₂O (APM),NH₂OH, KOH, HNO₃:NH₄F:H₂O, and/or the like. The dummy gate dielectric312 may be removed using a wet etch process, such as a diluted HF acid.Other processes and materials may be used. In some embodiments, therecess 910 may have a width W1 of about 10 nm to about 300 nm, and alength L1 of about 100 nm to about 2000 nm.

Next, referring to FIGS. 10A and 10B, one or more gate dielectric layers1010 is formed over a channel region of the fins 210 in accordance withsome embodiments. The respective step is illustrated as step 218 in theprocess flow shown in FIG. 21. In an embodiment, the gate dielectriclayer 1010 includes one or more high-k dielectric layers (e.g., having adielectric constant greater than 3.9) and may be formed as a conformallayer extending along the sidewalls of protruding fins 210 and the topsurface and the sidewalls of gate spacers 318 and the ILD 610. (The gatedielectric layers 1010 are not illustrated over the gate spacers 318 andthe ILD 610 in the plan view of the “A” figures for ease ofillustration.) For example, the one or more gate dielectric layers mayinclude one or more layers of a metal oxide or a silicate of Hf, Al, Zr,combinations thereof, and multi-layers thereof. Other suitable materialsinclude La, Mg, Ba, Ti, Pb, Zr, in the form of metal oxides, metalalloyed oxides, and combinations thereof. Exemplary materials includeMgO_(x), BaTi_(x)O_(y), BaSr_(x)Ti_(y)O_(z), PbTi_(x)O_(y),PbZr_(x)TiO_(z), SiCN, SiON, Si₃N₄, Al₂O₃, La₂O₃, Ta₂O₃, Y₂O₃, HfO₂,ZrO₂, HfSiON, YGe_(x)O_(y), YSi_(x)O_(y) and LaAlO₃, and the like. Theformation methods of gate dielectric layer 1010 include molecular-beamdeposition (MBD), ALD, PVD, and the like. In an embodiment, the gatedielectric layer 1010 may have a thickness of about 10 Å to about 25 Å.

In some embodiments, an interfacial layer (not shown) may be formed overthe channel region of the fins 210 prior to forming the gate dielectriclayer 1010, and the gate dielectric layer 1010 is formed over theinterfacial layer. The interfacial layer helps buffer the subsequentlyformed high-k dielectric layer from the underlying semiconductormaterial. In some embodiments, the interfacial layer is a chemicalsilicon oxide, which may be formed of chemical reactions. For example, achemical oxide may be formed using deionized water+ozone (DIO₃),NH₄OH+H₂O₂+H₂O (APM), or other methods. Other embodiments may utilize adifferent material or processes (e.g., a thermal oxidation or adeposition process) for the interfacial layer. In an embodiment, theinterfacial layer may have a thickness of about 3 Å to about 7 Å. Theinterfacial layer and/or the gate dielectric layers 1010 may extend onlyover the fin 210 (e.g., not over the STI regions 108, the gate spacers318, or the ILD 610), depending on the material and the processes usedto form those layers.

Thereafter, as illustrated in FIGS. 11A and 11B, a first work function(WF) layer 1110 is formed over the fins 210. The respective step isillustrated as step 218 in the process flow shown in FIG. 21. As will bedescribed in greater detail below, a work function structure comprisingone or more metal layers will be formed over the fins 210, wherein thework function metal will be patterned for each particular transistor.The work function of the gate electrode may be adjusted to the band-edgeof silicon or other underlying semiconductor material. For an NMOSdevice, the work function may be adjusted to close to the conductionband of silicon, and for a PMOS device, the work function may beadjusted to close to the valence band of silicon, to increase theperformance of the transistors.

In an embodiment, the first work function layer 1110 is formed throughdeposition, such as a conformal deposition method such as ALD or CVD, sothat the horizontal thickness T₁ of the horizontal portions and verticalthickness T₂ of vertical portions have thicknesses substantially equalto each other. For example, horizontal thickness T₁ and verticalthickness T₂ may have a difference smaller than about 20 percent or 10percent of thickness T₁. The thickness T₁ may be in the range betweenabout 5 Å and about 30 Å.

FIGS. 12A-12B illustrate formation of a first mask 1220 to subsequentlypattern the first WF layer 1110 in accordance with some embodiments. Therespective step is illustrated as step 220 in the process flow shown inFIG. 21. The first mask 1220 may comprise one or more layers of amasking material. For example, FIGS. 12A and 12B illustrate a firstsacrificial layer 1222 formed over the first WF layer 1110. The firstsacrificial layer 1222 may be formed of a bottom antireflective coating(BARC). Generally, during photolithography patterning, light may bereflected off the surface of the underlying material and back into thephotoresist material during the exposure process, wherein the reflectedlight may alter the intended pattern of the photoresist. A BARC layerformed of a material having the appropriate refractive index n to limitor prevent reflection of the exposing light back into the photoresistmaterial. In some embodiments, the first sacrificial layer 1222 may beformed of, for example, a dielectric, an organic material, or the like,and may be formed by, for example, spin coating, PECVD, CVD, or thelike. In some embodiments, the first sacrificial layer 1222 may be aresist underlayer film as described in U.S. Pat. No. 8,481,247, which isincorporated herein by reference in its entirety. Additionally, thefirst mask 1220 may comprise one or more additional masking layers, suchas the first patterned mask 1224. In some embodiments, the firstpatterned mask 1224 may be a photoresist exposed and developed to formthe pattern as illustrated in FIGS. 12A and 12B. Additional masks, suchas a silicon oxide, silicon nitride, combinations thereof, or the likemay be used in addition to, or instead of, the photoresist mask toprovide additional protections during etching.

As illustrated in FIGS. 12A and 12B, a first edge 1224 ₁ of the firstpatterned mask 1224 is shifted from a center line C between the adjacentfins, indicated in the figures as a first fin 210 _(A) and a second fin210 _(B), toward the first fin 210 _(A) by a distance D₂. As discussedin greater detail below with reference to FIGS. 16A and 16B, shiftingthe first edge 1224 ₁ of the first patterned mask 1224 toward the firstfin 210 _(A) allows subsequent masks to provide better coverage andprovide more uniform patterning of subsequent WF layers.

In some embodiments, a distance D₁ between the first fin 210 _(A) andthe second fin 210 _(B) is about 30 nm to about 100 nm, and a shiftdistance D₂ is between about 6 nm and about 40 nm. In some embodiments,the shift distance is about 20% to about 40% of the distance D₁ betweenthe first fin 210 _(A) and the second fin 210 _(B).

Next, as shown in FIGS. 13A and 13B, the first patterned mask 1224 isused as an etching mask to pattern the first sacrificial layer 1222 andthe first work function layer 1110. The respective step is illustratedas step 220 in the process flow shown in FIG. 21. In embodiments inwhich the first sacrificial layer 1222 is formed of bottomantireflective coating, the first sacrificial layer 1222 may be etchedusing a dry etch process, or other suitable etching processes, may beused. In the case dry etching is used, the process gas may include N₂,O₂, CH₄, CF₄, CHF₃, NF₃, SF₆, Br₂, HBr, Cl₂, or combinations thereof.Diluting gases such as N₂, O₂, or Ar may optionally be used. In someembodiments, the sacrificial layer 1222 may be patterned as the resistunderlayer film described in U.S. Pat. No. 8,481,247, which isincorporated herein by reference in its entirety. Thereafter, a wet etchprocess, or other suitable etching processes, may be used to pattern theunderlying first work function layer 1110. For example, in embodimentsin which the first work function layer 1110 is formed of TiN, a wetetching process using NH₄OH+H₂O₂+H₂O (APM), and/or the like, may beused. Other processes and materials may be used.

FIGS. 14A and 14B illustrate removal of the first patterned mask 1224and the first sacrificial layer 1222. The respective step is illustratedas step 220 in the process flow shown in FIG. 21. In an embodiment inwhich the first patterned mask 1224 is formed of a patternedphotoresist, the first patterned mask 1224 may be removed using anashing process in an ambient of N₂, H₂, O₂ and a temperature of about150° C. to about 350° C. In an embodiment in which the first sacrificiallayer 1222 is formed of bottom antireflective coating, the firstsacrificial layer 1222 may be removed using, for example, an ashingprocess in an ambient of N₂, H₂, O₂ and a temperature of about 150° C.to about 350° C. In some embodiments, an edge of the first work functionlayer 1010 extends a distance D₃ from the first fin 210 _(A) asillustrated in FIG. 14B of about 10 nm to about 40 nm.

Thereafter, as illustrated in FIGS. 15A and 15B, a second WF layer 1510is formed over the first WF layer 1110 in the area of the first fin 210_(A) and over the second fin 210 _(B). The respective step isillustrated as step 222 in the process flow shown in FIG. 21. In anembodiment, the second WF layer 1510 is formed through deposition, suchas a conformal deposition method such as ALD or CVD, so that thehorizontal thickness T₃ of the horizontal portions and verticalthickness T₄ of vertical portions of second work function layer 1510have thicknesses substantially equal to each other. For example,horizontal thickness T₃ and vertical thickness T₄ may have a differencesmaller than about 20 percent or 10 percent of thickness T₃. Thethickness T₃ may be in the range between about 5 Å and about 50 Å.

FIGS. 16A-16B illustrate formation of a second mask 1620 to subsequentlypattern the second WF layer 1510 in accordance with some embodiments.The respective step is illustrated as step 224 in the process flow shownin FIG. 21. The second mask 1620 may comprise one or more layers of amasking material. For example, FIGS. 16A and 16B illustrate a secondsacrificial layer 1622 formed over the second WF layer 1510. The secondsacrificial layer 1622 may be formed of a BARC, which may be formed ofsimilar materials and by similar processes as discussed above withreference to the first sacrificial layer 1222. Additionally, the secondmask layer 1620 may comprise one or more additional masking layers, suchas the second patterned mask 1624. In some embodiments, the secondpatterned mask 1624 may be a photoresist exposed and developed to formthe pattern as illustrated in FIGS. 16A and 16B. Additional masks, suchas a silicon oxide, silicon nitride, combinations thereof, or the likemay be used in addition to, or instead of, the photoresist mask toprovide additional protections during etching.

As illustrated in FIGS. 16A and 16B, the second patterned mask 1624 isshifted from a center line C between the first fin 210 _(A) and thesecond fin 210 _(B) toward the second fin 210 _(B). In some embodiments,the dimensions of the opening in the ILD 610 after forming variouslayers (e.g., the first WF layer 1110 and the second WF layer 1510) mayhinder or prevent the subsequent mask from sufficiently covering andprotecting the underlying layers during a subsequent etch process. As aresult, voids may form in, for example, the second sacrificial layer1622, and during an etch process to pattern the second WF layer 1510 thevoids in the second sacrificial layer 1622 mask layer may allow etchantsto undesirably remove portions of the second WF layer 1510 over thefirst fin 210 _(A). For illustrative purposes, a void is illustrated inFIG. 16B by the dotted region indicated by reference numeral 1650. Asillustrated, by shifting the edge 1224 ₁ of the first patterned mask1224 toward the first fin 210A and shifting an edge 1624 ₁ of the secondpatterned mask 1624 toward the second patterned mask 210B, sufficientamounts of the second sacrificial layer 1622 remains to prevent etchinginto the void 1650 and into the work function layers.

In some embodiments, a shift distance D₄ from the center line C towardthe second fin 210 _(E) is between about 6 nm and about 40 nm. In someembodiments, the shift distance D₄ is about 20% to about 40% of thedistance D₁ between the first fin 210 _(A) and the second fin 210 _(B).In some embodiments, an edge of the second work function layer 1510extends a distance D₅ from the first fin 210 _(A) as illustrated in FIG.17B of about 20 nm to about 90 nm.

Next, as shown in FIGS. 17A and 17B, the second patterned mask 1624 isused as an etching mask to pattern the second sacrificial layer 1622 andthe second WF layer 1510. The respective step is illustrated as step 224in the process flow shown in FIG. 21. In embodiments in which the secondsacrificial layer 1622 is formed of bottom antireflective coating, thesecond sacrificial layer 1622 may be etched using a dry etch process, orother suitable etching processes, may be used. In the case dry etchingis used, the process gas may include N₂, O₂, CH₄, CF₄, CHF₃, NF₃, SF₆,Br₂, HBr, Cl₂ or combinations thereof. Diluting gases such as N₂, O₂, orAr may optionally be used. In some embodiments, the sacrificial layer1222 may be patterned as the resist underlayer film described in U.S.Pat. No. 8,481,247, which is incorporated herein by reference in itsentirety. Thereafter, a wet etch process, or other suitable etchingprocesses, may be used to pattern the underlying second work functionlayer 1510. For example, in embodiments in which the second workfunction layer 1510 is formed of TiN, a wet etching process usingNH₄OH+H₂O₂+H₂O (APM), and/or the like, may be used. Other processes andmaterials may be used.

FIGS. 18A and 18B illustrate removal of the second patterned mask 1624and the second sacrificial layer 1622. The respective step isillustrated as step 224 in the process flow shown in FIG. 21. In anembodiment in which the second patterned mask 1624 is formed of apatterned photoresist, the second patterned mask 1624 may be removedusing an ashing process in an ambient of N₂, H₂, or O₂ and a temperatureof about 150° C. to about 300° C. In an embodiment in which the secondsacrificial layer 1622 is formed of bottom antireflective coating, thesecond sacrificial layer 1622 may be removed using, for example, anashing process in an ambient of N₂, H₂, or O₂, and a temperature ofabout 150° C. to about 350° C.

Thereafter, as illustrated in FIGS. 19A and 19B, a third work functionlayer 1910 is formed over the second work function layer 1510 in thearea of the first fin 210 _(A) and over the second fin 210 _(B). Therespective step is illustrated as step 226 in the process flow shown inFIG. 21. In an embodiment, the third work function layer 1910 is formedthrough deposition, such as a conformal deposition method such as ALD orCVD, so that the horizontal thickness T₅ of the horizontal portions andvertical thickness T₆ of vertical portions of third work function layer1910 have thicknesses substantially equal to each other. For example,horizontal thickness T₅ and vertical thickness T₆ may have a differencesmaller than about 20 percent or 10 percent of thickness T₅. Thethickness T₅ may be in the range between about 5 Å and about 50 Å.

FIGS. 20A and 20B illustrate filling the remaining opening with a gateelectrode 2020 in accordance with an embodiment. The respective step isillustrated as step 228 in the process flow shown in FIG. 21. The gateelectrode 2020 may be a metal selected from a group of W, Cu, Ti, Ag,Al, TiAl, TiAlN, TaC, TaCN, TaSiN, Mn, Co, Pd, Ni, Re, Ir, Ru, Pt, andZr. In some embodiments, the gate electrode 2020 comprises a metalselected from a group of TiN, WN, TaN, and Ru. Metal alloys such asTi—Al, Ru—Ta, Ru—Zr, Pt—Ti, Co—Ni and Ni—Ta may be used and/or metalnitrides such as WN_(x), TiN_(x), MoN_(x), TaN_(x), and TaSi_(x)N_(y)may be used. In some embodiments, the gate electrode 2020 has athickness in the range of about 5 nm to about 100 nm. The gate electrode2020 may be formed using a suitable process such as ALD, CVD, PVD,plating, or combinations thereof. A planarization process, such as aCMP, may be performed to remove excess materials of the gate dielectric1010, the first work function layer 1110, the second work function layer1510, the third work function layer 1910, and the gate electrode 2020from the upper surface of the ILD 610.

Other processes may be performed. For example, additional dielectriclayers may be formed and metallization layers may be formed tointerconnect the various transistors and/or other devices to formcircuits, external connectors may be formed, a singulation process maybe performed, and/or the like.

The materials and processes describe an example in which the fin 210_(A) is a PMOS transistor having three work function layers and fin 210_(B) is a NMOS transistor having one work function layer. For example,fin 210 _(A) may be a PMOS transistor having three work function layers,wherein the first work function layer is TiN or other p-type metal, thesecond work function layer is TiN or other p-type metal, and the thirdwork function layer is TiAl or other n-type metal. In this example, thefin 210 _(B) may be a NMOS having a single work function layer of TiAlor other n-type metal.

As another example in which the fin 210 _(A) is an NMOS transistorhaving three work function layers and fin 210 _(B) is a PMOS transistorhaving one work function layer. Other materials and configuration may beused. For example, fin 210 _(A) may be an NMOS having three workfunction layers, wherein the first work function layer is TiAl or othern-type metal, the second work function layer is TiAl or other n-typemetal, and the third work function layer is TiN or other p-type metal.In this example, the fin 210 _(B) may be a PMOS having a single workfunction layer of TiN or other P-type metal.

In accordance with an embodiment, a method is provided. The methodincludes forming a first dielectric layer over a first fin and a secondfin; forming a recess in the first dielectric layer, the first fin andthe second fin protruding above a bottom of the recess; forming a firstwork function layer over the first fin and the second fin; forming afirst patterned mask over the first work function layer, the firstpatterned mask terminating closer to the first fin than the second finsuch that the first work function layer over the second fin is exposed;removing the first work function layer from over the second fin and anarea between the first fin and the second fin, the first work functionlayer terminating at a position closer to the first fin than the secondfin; and removing the first patterned mask. A second work function layeris formed over the first work function layer and the second fin, asecond patterned mask is formed over the second work function layer, thesecond patterned mask terminating closer to the second fin than thefirst fin such that the second work function layer over the second finis exposed, the second work function layer is removed from over thesecond fin and an area between the first fin and the second fin, thesecond work function layer terminating at a position closer to thesecond fin than the first fin, and the second patterned mask is removed.The method further includes forming a third work function layer over thesecond work function layer and the second fin; and forming a metal layerover the third work function layer.

In accordance with an embodiment, a method is provided. The methodincludes forming a first work function layer over a first fin, the firstwork function layer terminating closer to the first fin than a secondfin; forming a second work function layer over the first work functionlayer, the second work function layer terminating closer to the secondfin than the first fin; forming a third work function layer over thesecond work function layer, the third work function layer extending overthe second fin; and forming a metal layer over the third work functionlayer.

In accordance with an embodiment, a device is provided. The deviceincludes a first fin; a second fin; a first work function metal layerextending over the first fin, the first work function metal layerterminating at a first location closer to the first fin than the secondfin, the first location being between the first fin and the second fin;a second work function metal layer extending over the first workfunction metal layer, the second work function metal layer terminatingat a second location closer to the second fin than the first fin, thesecond location being between the first fin and the second fin; and agate electrode over the first fin and the second fin.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a first dielectriclayer over a first fin and a second fin; forming a recess in the firstdielectric layer, the first fin and the second fin protruding above abottom of the recess; forming a first work function layer over the firstfin and the second fin; forming a first patterned mask over the firstwork function layer, the first patterned mask terminating closer to thefirst fin than the second fin such that the first work function layerover the second fin is exposed, wherein forming the first patterned maskcomprises: forming a first masking layer over the first work functionlayer, the first masking layer filling the recess; forming a firstphotoresist layer over the first masking layer; patterning the firstphotoresist layer to form a first patterned photoresist layer; andpatterning the first masking layer using the first patterned photoresistlayer as a mask; removing the first work function layer from over thesecond fin and an area between the first fin and the second fin, thefirst work function layer terminating at a position closer to the firstfin than the second fin; removing the first patterned mask; forming asecond work function layer over the first work function layer and thesecond fin; forming a second patterned mask over the second workfunction layer, the second patterned mask terminating closer to thesecond fin than the first fin such that the second work function layerover the second fin is exposed; removing the second work function layerfrom over the second fin and an area between the first fin and thesecond fin, the second work function layer terminating at a positioncloser to the second fin than the first fin; removing the secondpatterned mask; forming a third work function layer over the second workfunction layer and the second fin; and forming a metal layer over thethird work function layer.
 2. The method of claim 1, further comprisingforming a gate dielectric over the first fin and the second fin prior toforming the first work function layer.
 3. The method of claim 1, whereinthe first work function layer extends along sidewalls of the recess. 4.The method of claim 3, wherein the second work function layer extendsalong sidewalls of the recess.
 5. The method of claim 1, wherein formingthe second patterned mask comprises: forming a second masking layer overthe second work function layer, the second masking layer filling therecess; forming a second photoresist layer over the second maskinglayer; patterning the second photoresist layer to form a secondpatterned photoresist layer; and patterning the second masking layerusing the second patterned photoresist layer as a mask.
 6. The method ofclaim 1, wherein a distance from the first fin to an edge of the firstwork function layer is 10 nm to 40 nm.
 7. The method of claim 6, whereina distance from the first fin to an edge of the second work functionlayer is 20 nm to 90 nm.
 8. The method of claim 1, wherein the first finand the second fin are free of an intervening fin interposed between thefirst fin and the second fin.
 9. A method comprising: forming adielectric layer over a first fin and a second fin; and forming a recessin the dielectric layer, the first fin and the second fin protrudingthrough a bottom of the recess; forming a first work function layer overthe first fin, the first work function layer terminating closer to thefirst fin than the second fin; forming a second work function layer overthe first work function layer and the first fin, the second workfunction layer terminating closer to the second fin than the first fin,wherein the first fin and the second fin are adjacent fins with nointervening fins interposed between the first fin and the second fin,wherein the first work function layer and the second work function layerare formed along sidewalls of the recess; forming a third work functionlayer over the second work function layer, the third work function layerextending over the second fin; and forming a metal layer over the thirdwork function layer.
 10. The method of claim 9, wherein the metal layeris a gate electrode.
 11. The method of claim 9, wherein a width of therecess is from 100 nm to 2000 nm.
 12. The method of claim 9, wherein athickness of the first work function layer is 5 Å to 30 Å.
 13. Themethod of claim 12, wherein a thickness of the second work functionlayer is 5 Å to 50 Å.
 14. The method of claim 9, wherein the second workfunction layer completely separates the third work function layer fromthe first work function layer.
 15. The method of claim 9, wherein adistance from the first fin to an edge of the second work function layeris 20 nm to 90 nm.
 16. A method comprising: forming a first conductivelayer over a first fin, the first conductive layer terminating closer tothe first fin than a second fin, wherein the first fin and the secondfin extend above a shallow trench isolation, wherein the shallow trenchisolation extends continuously between the first fin and the second finalong a shortest line between the first fin and the second fin; forminga second conductive layer over the first conductive layer, the secondconductive layer extending over the first fin and terminating closer tothe second fin than the first fin; forming a third conductive layer overthe second conductive layer, the third conductive layer extending overthe first fin and the second fin, the first conductive layer beinginterposed between the second conductive layer and the first fin; andforming a metal layer over the first fin and the second fin.
 17. Themethod of claim 16, further comprising: prior to forming the firstconductive layer, forming a dielectric layer, wherein the first fin andthe second fin are exposed in a recess in the dielectric layer, whereinthe first conductive layer extends along a sidewall of the recess. 18.The method of claim 17, further comprising planarizing the metal layer,wherein an upper surface of the dielectric layer is level with an uppersurface of the metal layer after planarizing.
 19. The method of claim16, further comprising forming a gate dielectric prior to forming thefirst conductive layer, wherein the gate dielectric extends over thefirst fin and the second fin.
 20. The method of claim 16, wherein adistance from a midpoint between the first fin and the second fin isbetween about 20% and about 40% of a distance between the first fin andthe second fin.